NDLI: Thermal stability of polysilicon resistors

Content Provider	IEEE Xplore Digital Library
Author	Suarez, J.E. Johnson, B.E. El-Kareh, B.
Copyright Year	1991
Description	Author affiliation: IBM Corp., Essex Junction, VT, USA (Suarez, J.E.; Johnson, B.E.; El-Kareh, B.)
Abstract	The stability of polysilicon sheet resistance (R/sub s/) is studied as a function of conventional furnace anneal (CFA) and rapid thermal anneal (RTA). Polysilicon films of 100-nm, 200-nm, and 300-nm thickness are doped with boron, borofluoride, arsenic, or phosphorous, and subjected to a CFA anneal matrix simulating the thermal cycles of a digital-base BiCMOS process. RTA is introduced at the beginning or the end of the CFA anneal cycle to study its effectiveness in stabilizing the sheet resistance. CFA temperatures are varied from 550 degrees C to 900 degrees C, and RTA temperatures from 900 degrees C to 1100 degrees C. R/sub s/ is not only sensitive to anneal temperatures and duration, but also to the sequence in which the different thermal steps are introduced. A furnace anneal as low as 550 degrees C, following a furnace activation anneal of 900 degrees C or RTA at 1000 degrees C, results in a dramatic increase in R/sub s/. Then, subjecting the film to RTA at 1000 degrees C for five seconds recovers R/sub s/ to an extent which depends on dopant species and thermal history. The final thermal cycle in the sequence has the most dramatic effect on sheet resistance.<>
Starting Page	537
Ending Page	543
File Size	521388
Page Count	7
File Format	PDF
ISBN	0780300122
DOI	10.1109/ECTC.1991.163929
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1991-05-11
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal resistance Thermal stability Resistors Rapid thermal annealing Furnaces Temperature sensors Rapid thermal processing Boron Simulated annealing BiCMOS integrated circuits
Content Type	Text
Resource Type	Article

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