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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Reinke, R.R. |
| Copyright Year | 1991 |
| Description | Author affiliation: Elform Inc., Reno, NV, USA (Reinke, R.R.) |
| Abstract | Tape automated bonding (TAB) on glass (TOG) was developed as a way to package high-resolution LCDs (liquid crystal displays) in mass production. This technology bonds the tape carrier LC driver LSIs directly onto one side of an LCD panel using anisotropic conductive film. To the adjacent side of the LCD panel, flexible circuit monosotropic heat seal connectors (HSCs) are used to interconnect the LSIs to the glass and can be used to interconnect to the PWB (printed wiring board). TOG is the chosen method for attaching TAB to glass, and the HSCs are widely used for attaching TAB to glass, TAB to PWBs, and glass to rigid PWBs. The HSCs have been successful in driving multiplex-addressed multicolor LCDs whose effective viewing area is 8 in*8 in and smaller displays in mass production. The large panel requires 640 terminations to each side of the glass panel and to four row and column PWBs for a total of 5120 terminations on a pitch of 0.011 in.< |
| Starting Page | 355 |
| Ending Page | 361 |
| File Size | 496958 |
| Page Count | 7 |
| File Format | |
| ISBN | 0780300122 |
| DOI | 10.1109/ECTC.1991.163900 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1991-05-11 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Liquid crystals Glass Integrated circuit interconnections Liquid crystal displays Mass production Joining processes Bonding Packaging Driver circuits Anisotropic conductive films |
| Content Type | Text |
| Resource Type | Article |
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