NDLI: Investigations of laser soldered TAB inner lead contacts

Content Provider	IEEE Xplore Digital Library
Author	Zakel, E. Azdasht, G. Reichl, H.
Copyright Year	1991
Description	Author affiliation: Tech. Univ. of Berlin, Germany (Zakel, E.; Azdasht, G.; Reichl, H.)
Abstract	The results of TAB (tape automated bonding) inner lead bonding with a pulsed Nd:YAG laser are presented. Tapes with three metallizations (Sn, Ni-Sn, and Au) were laser-soldered to bumps consisting of gold and gold-tin. The pull strength of laser-soldered TAB-contacts were optimized by variation of laser power, and reliability investigations were performed. An accumulation of eutectic 80/20 Au-Sn solder in the bonded interface results in a strong degradation due to Kirkendall pore formation in the ternary Cu-Sn-Au system. The application of a tape with a diffusion barrier of Ni inhibits this effect. During thermal aging these contacts show a strong degradation of pull forces, which is attributed to the formation of brittle intermetallic compounds of the elements Ni, Sn, and Au in the contact area. Laser soldering of Au-plated tapes to Au-Sn solder bumps is possible. The contacts show optimal pull forces and a minimal degradation after thermal aging. This is attributed to the formation of an intermetallic compound with a high stability.<>
Starting Page	497
Ending Page	506
File Size	1027439
Page Count	10
File Format	PDF
ISBN	0780300122
DOI	10.1109/ECTC.1991.163923
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1991-05-11
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lead Bonding Gold Thermal degradation Tin Power lasers Thermal force Aging Intermetallic Optical pulses
Content Type	Text
Resource Type	Article

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Investigations of laser soldered TAB inner lead contacts

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Au-Sn bonding metallurgy of TAB contacts and its influence on the Kirkendall effect in the ternary Cu-Au-Sn

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