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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Sasaki, S. Konno, R. Tomimuro, H. Ohsaki, T. |
| Copyright Year | 1991 |
| Description | Author affiliation: NTT Appl. Electron. Lab., Tokyo, Japan (Sasaki, S.; Konno, R.; Tomimuro, H.; Ohsaki, T.) |
| Abstract | The authors describe three-dimensional electromagnetic field analysis of interconnections in copper-polyimide multichip modules. This analysis is based on the spatial network method, a lattice network model of Maxwell's equation formulated in the time domain by Bergeron's method. Results of simulating reflection and transmission waves at interconnections are presented. Frequency characteristics of the scattering parameter S/sub 21/ are calculated using the fast Fourier transform. The 3-dB down cutoff frequencies of wire-bonded, TAB (tape automated bonding), and FCB (flip-chip bonding) interconnections are respectively 6, 14, and 40 GHz. Those of the interconnection vias are over 200 GHz.< |
| Starting Page | 70 |
| Ending Page | 76 |
| File Size | 577009 |
| Page Count | 7 |
| File Format | |
| ISBN | 0780300122 |
| DOI | 10.1109/ECTC.1991.163856 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1991-05-11 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Electromagnetic fields Electromagnetic analysis Bonding Multichip modules Lattices Maxwell equations Time domain analysis Electromagnetic reflection Frequency Scattering parameters |
| Content Type | Text |
| Resource Type | Article |
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