NDLI: High frequency modeling for 10 Gbps DFB laser diode module packaging

Content Provider	IEEE Xplore Digital Library
Author	Seong-Su Park Min Kyu Song Seung Goo Kang Nam Hwang Hee Tae Lee Heung Ro Choo Kwang Eui Pyun
Copyright Year	1996
Description	Author affiliation: Compound Semicond. Res. Dept., Electron. & Telecommun. Res. Inst., Taejon, South Korea (Seong-Su Park)
Abstract	In packaging the laser diode several electrical requirements must be satisfied. The conventional packaging method which consists of transmission line, matching resistor and wire bonding interconnect showed good result for the modulation bandwidth requirement of greater than 10 GHz. However the return loss requirement was not content with less than -10 dB. To analyze the effects of package parasitics on return loss, we proposed a small signal circuit model of a laser diode module. From the small signal measurement data, we obtained the small signal circuit model of the laser diode for each bias current, which contains package parasitics and intrinsic laser diode characteristics. Considering both the intrinsic laser diode characteristics and total parasitic effects of the packaged module, the overall frequency response of the laser diode module was simulated and compared to the experimental results. The simulation results on the small signal modulation bandwidth and return loss showed a good agreement with measurements. However, the return loss does not meet the requirement for 10 Gbps laser diode module. Therefore, the wire bonding effect on the return loss was analyzed. The characteristics of wire bonding inductance which affect the return loss were simulated using an interconnect analysis program. As a result, shorter wire bonding length would be the best step to reduce the package induced inductance.
Starting Page	884
Ending Page	887
File Size	451473
Page Count	4
File Format	PDF
ISBN	0780332865
ISSN	05695503
DOI	10.1109/ECTC.1996.550512
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Frequency Diode lasers Packaging Wire Bonding Integrated circuit interconnections Bandwidth Inductance Distributed parameter circuits Resistors
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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