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  1. Circuits and Devices Magazine
  2. Year : 1999 Volume : 15
  3. Issue 4
  4. Making a better interconnection through modeling
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Year : 2006 Volume : 22
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Year : 1999 Volume : 15
Issue 6
Issue 5
Issue 4
Standardizing compact models for IC simulation
Tipping the scales in your favor when uprating
Making a better interconnection through modeling
IEEE Elected Fellows - 1998
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Making a better interconnection through modeling

Content Provider IEEE Xplore Digital Library
Author Gomez, J.M. Alonso, J.I.
Copyright Year 1988
Abstract Introduces a simple technique for implementing nonuniform coupled transmission lines with frequency-dependent parameters into SPICE. The proposed method relies on the analog behavioral modeling option, which bypasses the problems of circuit synthesis and the need to develop sophisticated techniques for analysis of these kind of structures. We describe basic principles that serve to construct the model, derive a generalized model of characteristics typical of an n-conductor nonuniform lossy coupled transmission line system, establish the relationship between the S-parameters and the voltage-dependent voltage sources of the model, and deal with the implementation of the developed model to each port. Examples that illustrate the advantages of the model and concordance with previously published results are also presented.
Starting Page 24
Ending Page 32
Page Count 9
File Size 725724
File Format PDF
ISSN 87553996
Volume Number 15
Issue Number 4
Language English
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date 1999-07-01
Publisher Place U.S.A.
Access Restriction Subscribed
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword Integrated circuit interconnections Distributed parameter circuits Coupling circuits SPICE Propagation losses Frequency Integrated circuit packaging Circuit simulation Circuit synthesis Scattering parameters
Content Type Text
Resource Type Article
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