NDLI: Electroplated solder joints for optoelectronic applications

Content Provider	IEEE Xplore Digital Library
Author	Hongtao Han Boudreau, R. Song-Sheng Tan
Copyright Year	1996
Description	Author affiliation: AMP Inc., Harrisburg, PA, USA (Hongtao Han)
Abstract	Flip-chip solder joint technology has been widely used in the integrated circuit (IC) packaging and optoelectronics packaging. Several solder deposition techniques have been developed. In this paper, we will report on an electroplating technique to form Pb/Sn (both eutectic and 95/5% Pb and Sn) solder joints in any shape. For some optoelectronic applications, we successfully plated the Pb/Sn solder pads larger than the under bump metallurgy (UBM). In addition to solder shape and size, solder pad profile (cross section) is one of the most important issues for passive alignment flip chip bonding of optoelectronic devices where the vertical clearance is sometimes limited to less than one micron. Our experiments show that the solder pads surface profile is highly dependent on the process conditions. We found that in addition to an electric field effect, electrolyte diffusion played a very important role in forming the solder pad profile. Based on our model, we optimized plating conditions and improved the thickness uniformity to 0.1 /spl mu/m (standard deviation) over 2-inch wafers for an average solder pad thickness of 4.6 /spl mu/m. This process reduces the cost of solder deposition as well as providing a means for controlling airborne Pb toxicity which might be found for pads deposited by vacuum deposition methods.
Starting Page	963
Ending Page	966
File Size	636584
Page Count	4
File Format	PDF
ISBN	0780332865
ISSN	05695503
DOI	10.1109/ECTC.1996.550763
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Tin Integrated circuit packaging Shape Flip chip solder joints Integrated circuit technology Flip chip Bonding Optoelectronic devices Semiconductor device modeling
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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