NDLI: An interim report on the comparisons of polymide to non-polyimide reliability for C4

Content Provider	IEEE Xplore Digital Library
Author	Phillips, J. Margaritis, G. Afshari, B.
Copyright Year	1996
Description	Author affiliation: Hewlett-Packard Ltd., USA (Phillips, J.)
Abstract	Thermal cycling of non-underfilled C4 assemblies with polyimide shows that they are more reliable than C4 without polyimide. However, the reliability of underfilled assemblies of C4 with or without polyimide appears to be the same under thermal cycling conditions. The reason is that in non-underfilled assemblies without polyimide, the failure mode is adhesive failure of the UBM/passivation interface, with subsequent silicon cracking. In all other cases the failure mode is solder fatigue cracking. Finite Element Method analysis indicates that polyimide has no advantage over non-polyimide C4 in stress reduction at the interface. Thus, it is inferred that polyimide must enhance the adhesive strength of the system. However, such enhancement is unnecessary in underfilled systems, due to the significant decrease in the stresses from the presence of the underfill.
Starting Page	893
Ending Page	896
File Size	821333
Page Count	4
File Format	PDF
ISBN	0780332865
ISSN	05695503
DOI	10.1109/ECTC.1996.550751
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polyimides Passivation Assembly Protection Silicon Thermal stresses System testing Glass Multichip modules Power system interconnection
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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