NDLI: Plastic Packaging Consortium-first year results

Content Provider	IEEE Xplore Digital Library
Author	Nguyen, L.T. Giberti, R.W.
Copyright Year	1996
Description	Author affiliation: Nat. Semicond. Corp., Santa Clara, CA, USA (Nguyen, L.T.)
Abstract	The Plastic Packaging Consortium is a funded Technology Reinvestment Project (TRP) awarded in the FY94 competition on low-cost electronic packaging. The ten companies $20M+ cost-shared effort, led by National Semiconductor Corp., will establish the on-shore infrastructure to manufacture low-cost, high density, high performance "ruggedized" plastic packages. This initiative comes from the increasing need to improve complexity, performance, and reliability of plastic packages for both military and commercial use, while lowering the total system cost. The Program focuses on three areas of improvement: (1) plastic package "ruggedization"; (2) plastic package thermal enhancement; and, (3) high density plastic packages. Advances in molding compounds, die attach materials, leadframe materials, leadframe design, and reliability characterization will be accomplished. The deliverables at the end of the two-year Program will be plastic package processes and materials, which require no dry-bagging, eliminate "popcorning", improve low-cost (stamped) fine pitch leadframes, and utilize low-cost interconnect processes for high density packaging. This paper reports the results obtained in the three focus areas after the first year of activities.
Starting Page	1239
Ending Page	1243
File Size	669976
Page Count	5
File Format	PDF
ISBN	0780332865
ISSN	05695503
DOI	10.1109/ECTC.1996.550893
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Plastic packaging Electromagnetic compatibility Microassembly Mechanical factors Thermal stresses Heat sinks Electronic components Resins Lead Materials testing
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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