NDLI: An improvement in reflow performance of plastic packages

Content Provider	IEEE Xplore Digital Library
Author	Tae-Je Cho Kyu-Jin Lee Min-Ho Lee Seung-Ho Ahn Se-Yong Oh
Copyright Year	1996
Description	Author affiliation: Samsung Electron. Co., Kiheung, South Korea (Tae-Je Cho)
Abstract	The influence of die pad design and die attach adhesive on the resistance of a thin small out line package (TSOP) to reflow cracking has been investigated. Mechanisms of reflow cracking were studied using scanning acoustic tomography (SAT) and scanning electron micrography (SEM). For more precise analysis, computational calculations of stress were conducted. In the case of dimpled die pad, an experimental die adhesive with lower moisture absorption and higher adhesion strength showed excellent resistance to reflow cracking, resulting in crack-free performance in level I preconditioning tests. However,packages with the slot lead frame failed in level I preconditioning tests. The failure was due to the interfacial delamination between the bottom surface of die and the epoxy molding compound (EMC). SAT showed that the delamination initiated at the periphery of the slot during temperature cycling in preconditioning. During the subsequent soaking and IR reflow, moisture condensed at the delaminated interface generated the high vapour pressure that exceeded the fracture strength of the EMC. In other words, the interfacial integrity between the bottom surface of die and the molding compound is critical to the reflow cracking in packages with slot lead frame.
Starting Page	931
Ending Page	935
File Size	1135141
Page Count	5
File Format	PDF
ISBN	0780332865
ISSN	05695503
DOI	10.1109/ECTC.1996.550757
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Plastic packaging Moisture Testing Delamination Surface cracks Electromagnetic compatibility Microassembly Tomography Electrons Photomicrography
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in