NDLI: Analysis of electrical resistance monitoring of PCMCIA interconnection failures

Content Provider	IEEE Xplore Digital Library
Author	Zheng, D. Constable, J.H.
Copyright Year	1996
Description	Author affiliation: Dept. of Electr. Eng., Binghamton Univ., NY, USA (Zheng, D.)
Abstract	High resolution electrical resistance measurements were used to monitor interconnection failures on PCMCIA test cards. The cards were clamped at the connector end by a fixture which was attached to a shaker. The shaker was excited at the card's first resonant mode to induce interconnect failures. During the vibration, electrical resistance of the interconnects was monitored with sufficient resolution to measure the strain induced resistance change. Three daisy-chained modules on the PCMCIA test card were studied. These modules were: a 176 lead QFP, a 40 lead Type II TSOP, and a 40 lead Type I TSOP. The resistance measuring technique used has been called resistance spectroscopy and had a resolution of better than 1 /spl mu//spl Omega/. Resistance measurements were made on nine test cards, and partial measurements were made on another eleven. A finite element analysis of the surface strain on the card was used to estimate the relative contributions to the measured resistance from the solder joints, leads, and card traces.
Starting Page	808
Ending Page	814
File Size	1358138
Page Count	7
File Format	PDF
ISBN	0780332865
ISSN	05695503
DOI	10.1109/ECTC.1996.550501
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electric resistance Electrical resistance measurement Strain measurement Lead Condition monitoring Testing Vibration measurement Surface resistance Connectors Fixtures
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in