NDLI: Thermal-aware on-line task allocation for 3D multi-core processor throughput optimization

Content Provider	IEEE Xplore Digital Library
Author	Chiao-Ling Lung Yi-Lun Ho Ding-Ming Kwai Shih-Chieh Chang
Copyright Year	2011
Description	Author affiliation: Information and Communications Research Laboratories, Industrial Technology Research Institute, HsinChu 31040, Taiwan (Ding-Ming Kwai) \|\| Department of Computer Science, National Tsing Hua University, HsinChu 30013, Taiwan (Chiao-Ling Lung; Yi-Lun Ho; Shih-Chieh Chang)
Abstract	Three-dimensional integrated circuit (3D IC) has become an emerging technology in view of its advantages in packing density and flexibility in heterogeneous integration. The multi-core processor (MCP), which is able to deliver equivalent performance with less power consumption, is a candidate for 3D implementation. However, when maximizing the throughput of 3D MCP, due to the inherent heat removal limitation, thermal issues must be taken into consideration. Furthermore, since the temperature of a core strongly depends on its location in the 3D MCP, a proper task allocation helps to alleviate any potential thermal problem and improve the throughput. In this paper, we present a thermal-aware on-line task allocation algorithm for 3D MCPs. The results of our experiments show that our proposed method achieves 16.32X runtime speedup, and 23.18% throughput improvement. These are comparable to the exhaustive solutions obtained from optimization modeling software LINGO. On average, our throughput is only 0.85% worse than that of the exhaustive method. In 128 task-to-core allocations, our method takes only 0.932 ms, which is 57.74 times faster than the previous work.
Starting Page	1
Ending Page	6
File Size	481988
Page Count	6
File Format	PDF
ISBN	9781612842080
ISSN	15301591
e-ISBN	9783981080186
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-03-14
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	European Design Automation Association (EDAA)
Subject Keyword	Resource management Three dimensional displays Throughput Heat sinks Mathematical model Computational modeling Runtime temperature uniformity Multi-core processor task allocation thermal awareness three-dimensional integration throughput optimization
Content Type	Text
Resource Type	Article

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