NDLI: Magnetic Properties of Exchange-Coupled L1<formula formulatype=inline><tex Notation=TeX>$_{0}$</tex></formula>-FePt/Fe Composite Elements

Content Provider	IEEE Xplore Digital Library
Author	Goll, D. Breitling, A. Macke, S.
Copyright Year	1965
Abstract	Exchange-coupled L1₀ -FePt/Fe composite systems with out-of-plane anisotropy are produced to study the influence of the soft magnetic layer thickness and of the character of the interface between hard magnetic L1₀-FePt and soft magnetic Fe on the magnetic properties. By the soft magnetic layer thickness d _Fe the coercivity can be tailored according to a 1/d _Fe ² relation. By depositing part of the Fe layer at elevated temperatures a graded interface between the L1₀-FePt layer and the Fe layer is formed which allows an additional fine tuning of the coercivity. This behavior is confirmed by micromagnetic numerical simulations. The simulations furthermore show that the reversal behavior and the thermal stability are nearly the same for out-of-plane and in-plane anisotropy of L1₀-FePt. If the remanent magnetization configuration shows deviations from the homogeneous magnetization distribution an alternative low-field thermal reversal mode occurs.
Sponsorship	IEEE Magnetics Society
Starting Page	3472
Ending Page	3475
Page Count	4
File Size	577029
File Format	PDF
ISSN	00189464
Volume Number	44
Issue Number	11
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-11-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Magnetic properties Iron Magnetic anisotropy Perpendicular magnetic anisotropy Magnetosphere Soft magnetic materials Anisotropic magnetoresistance Coercive force Magnetization Interconnected systems perpendicular magnetic recording Exchange-coupled composite media FePt micromagnetism
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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