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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Li, C.Y. Hua, Z.K. Luo, Y.X. Cao, L.Q. Zhang, J.H. |
| Copyright Year | 2008 |
| Description | Author affiliation: Key Lab. of Adv. Display & Syst. Applic., Shanghai Univ., Shanghai (Hua, Z.K.; Zhang, J.H.) || Sch. of Mech. & Electron. Eng. & Autom., Shanghai Univ., Shanghai (Li, C.Y.) || Intel Technol. Dev., Shanghai Co. Ltd., Shanghai (Luo, Y.X.; Cao, L.Q.) |
| Abstract | Stacked die package is a key technique to meet the requirements of smaller size and higher density of electronic products. Moisture plays an important role in the reliability of electronic devices, especially with high temperature, in which the major failures are from corrosion, delamination and crack. The delamination and crack make the device to be easily weak and sensitive to external environment. And other failures, such as leakage current and open circuit could be caused by moisture corrosion. The moisture induced failure in the stacked die packaging has been studied in this work. The moisture absorption test was experimentally carried out under different conditions according to JEDEC standard. Thru Scanning Acoustic Microscope (T-SAM) and Scanning Electron Microscope (SEM) were used for further investigation. The elimination of such failure and how to control the moisture absorption still need to be studied. |
| Starting Page | 1175 |
| Ending Page | 1178 |
| File Size | 3913839 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424428137 |
| DOI | 10.1109/ESTC.2008.4684519 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-09-01 |
| Publisher Place | UK |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Temperature sensors Scanning electron microscopy Acoustic testing Absorption Corrosion Moisture Leakage current Delamination Circuit testing Electronics packaging |
| Content Type | Text |
| Resource Type | Article |
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