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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Szocs, E. Schwager, F. Toben, M. Brese, N. |
| Copyright Year | 2008 |
| Description | Author affiliation: Rohm & Haas Electron. Mater., Littau (Szocs, E.; Schwager, F.) |
| Abstract | A new indium electroplating process was developed which provides pure indium deposits suitable as thermal interface materials (TIM) in electronic industry. The main goals of the project were: i.) to develop a stable, high speed indium plating process; ii.) to obtain pure indium deposits with a low melting point (156degC) and high thermal conductivity (82 W/mldrK); iii.) to provide good adhesion to the substrate with a void-free interface. The electrochemical plating bath is based on an acidic electrolyte with copolymer additives. Typical plating conditions are: pH 0.9-1.2, current density 0.5-20ASD, temperature 30-60degC and a metal ion concentration of 30-60 g/l. Uniform deposit thicknesses of a few microns up to several hundred microns can be achieved at a plating rate of 180 microns per hour at a current density of 10ASD. Good adhesion to standard nickel-plated substrates (no delamination or voids allowed) is critical for meeting the thermal and reliability targets. Adherent, void-free deposits were obtained with thermal conductivity and thermal expansion data that correspond favourably to literature values for the bulk metal. |
| Starting Page | 347 |
| Ending Page | 350 |
| File Size | 5017880 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424428137 |
| DOI | 10.1109/ESTC.2008.4684373 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-09-01 |
| Publisher Place | UK |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal expansion Additives Temperature Adhesives Electronics industry Thermal conductivity Indium Current density Conducting materials Delamination |
| Content Type | Text |
| Resource Type | Article |
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