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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Han Seungwoo Kim Taeok Lee Hakjoo Lee Hyunwoo |
| Copyright Year | 2008 |
| Description | Author affiliation: Korea Inst. of Machinery & Mater., Pusan Nat. Univ., Pusan (Han Seungwoo; Lee Hakjoo) || Sch. of Mech. Eng., Pusan Nat. Univ., Pusan (Kim Taeok; Lee Hyunwoo) |
| Abstract | As microsystem components decrease in size and current densities in interconnects increase, the device temperature increases. Thus the mechanical behavior of thin films at elevated temperature will become increasingly important. We developed the micro tensile testing system to evaluate the mechanical properties of thin films at elevated temperatures. The testing system consists of the high temperature furnace and the DIC (Digital Image Correlation) system which measures the strain of the specimen in real time. Programs of the testing system were developed using LabVIEW 8.5 programming language and Vision Development Module 8.5. The material of specimen is Ni thin film made by electroplating that is used as a UBM (under bump metallurgy) material. In this study, tensile tests were performed at room and elevated temperatures. As results, stress-strain curves were plotted at each temperature, and the mechanical properties such as Youngpsilas modulus, yield strength and tensile strength were acquired. |
| Starting Page | 477 |
| Ending Page | 480 |
| File Size | 5120349 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424428137 |
| DOI | 10.1109/ESTC.2008.4684394 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-09-01 |
| Publisher Place | UK |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Real time systems System testing Temperature Furnaces Digital images Inorganic materials Strain measurement Mechanical factors Transistors Current density |
| Content Type | Text |
| Resource Type | Article |
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