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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Wunderle, B. Kallmayer, C. Walter, H. Braun, T. Michel, B. Reichl, H. |
| Copyright Year | 2008 |
| Description | Author affiliation: Fraunhofer Inst. Zuverlassigkeit und Mikrointegration, Berlin (Wunderle, B.; Kallmayer, C.; Walter, H.; Braun, T.; Michel, B.) || Forschungsschwerpunkt Technol. der Mikroperipherik, Tech. Univ. Berlin, Berlin (Reichl, H.) |
| Abstract | This paper addresses the reliability of flip-chip on flex (FCOF) assemblies glued with an Ag-particle filled anisotropic conductive adhesive (ACA). As the description of FCOF failure gives still much scope for speculation, a physics of failure based approach is developed here, taking into account the changing thermo-mechanical properties of the ACA under temperature and moisture. A failure hypothesis is formulated based on the loss of contact pressure. Material analysis, material characterisation, finite element (FE) modeling and lifetime tests have been employed to establish correlations to support this failure hypothesis. It was found, that moisture plays the most important role for interconnect failure. The model is able to predict quantitative changes of force as function of loading parameters and correlate them qualitatively to the experimental mean time to failure. New insights are provided about the stress fields at the ACA bump. The model is discussed with respect to a direct prediction of failure versus time. |
| Starting Page | 271 |
| Ending Page | 280 |
| File Size | 15311623 |
| Page Count | 10 |
| File Format | |
| ISBN | 9781424428137 |
| DOI | 10.1109/ESTC.2008.4684361 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-09-01 |
| Publisher Place | UK |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Anisotropic magnetoresistance Temperature Thermomechanical processes Moisture Predictive models Conducting materials Conductive adhesives Assembly Physics Testing |
| Content Type | Text |
| Resource Type | Article |
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