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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Seongjun Kim Keun-Soo Kim Izuta, G. Suganuma, K. |
| Copyright Year | 2008 |
| Description | Author affiliation: Inst. of Sci. & Ind. Res., Osaka Univ., Osaka (Seongjun Kim; Keun-Soo Kim; Suganuma, K.) || Manuf. Eng. Center, Mitsubishi Electr. Corp., Amagasaki (Izuta, G.) |
| Abstract | Interfacial reaction and reliability of Si die attached joints with Zn-xSn (chi= 20, 30, 40 wt%) were investigated, and Pb-5wt%Sn, and Au-20wt% were compared as a typical high temperature solder alloy. The joining strength of Cu/solder/Cu joints was investigated using the as soldered joints and thermal cycled joints up to 2000 cycles. At the interface with Si die coated with Au/TiN thin layers, the TiN layer did not react with the solder and worked as a good protective layer. At the interface with Cu, for Zn-Sn solders, $CuZn_{5}$ and $Cu_{5}Zn_{8}$ IMC layers was confirmed. Au-20Sn and Pb-5Sn solder forms $zeta-Au_{5}Sn$ and $Cu_{3}Sn$ IMC layers at the interface with Cu, respectively. For improving the joint reliability, TiN layer was proposed as a protective layer and was applied to the DBC substrates. For the die attached joints on DBC substrates coated with Au/TiN thin layers, no fatigue crack has been found until 1000 cycles of thermal cycling test. The joining strength of the Cu/solder/Cu joints with Zn-Sn solder was about 30~34 MPa, which was higher than that of Pb-5Sn solder (26.2 MPa). For the thermal cycled Cu/solder/Cu joints up to 2000cycles, Zn-Sn solder also shows the higher joining strength than that of Pb-5Sn solder. |
| Starting Page | 411 |
| Ending Page | 416 |
| File Size | 5119607 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424428137 |
| DOI | 10.1109/ESTC.2008.4684383 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-09-01 |
| Publisher Place | UK |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Gold Temperature Silicon alloys Environmentally friendly manufacturing techniques Lead Tin Fatigue Protection Zinc Testing |
| Content Type | Text |
| Resource Type | Article |
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