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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Cheng-Ta Ko Ying-Ching Shih Jing-Yao Chang Tzu-Ying Kuo Yu-Hua Chen Ostmann, A. Manessis, D. |
| Copyright Year | 2008 |
| Description | Author affiliation: Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu (Cheng-Ta Ko; Ying-Ching Shih; Jing-Yao Chang; Tzu-Ying Kuo; Yu-Hua Chen) || Fraunhofer Inst. for Reliability & Microintegration (IZM), Berlin (Ostmann, A.; Manessis, D.) |
| Abstract | This paper brings into light a new ultra-thin and highly flexible package with embedded active chips. In this technology, no supporting and permanent substrates were needed. Copper foil was used as temporal substrate, and it became the bottom circuit after patterning and etching processes. Ultra-thin chips with 20~25 mum thickness were assembled directly on the structured copper foils in a flip-chip fashion. The gap between chip and copper foil was only about 10 mum. Subsequently, the chips were embedded into flexible adhesive/polyimide polymer layers or alternatively in highly elastic polyurethane materials, with a copper foil always laminated on the top. The resultant ultra-thin film package (UTFP) has a thickness of 100 mum only. Each package sticking on a rod with 10 mm diameter could pass the electrical measuring. Stacking of three-layer chip embedded packages had also been realized and passed electrical measurements. The process details on each core technique will be disclosed, and some results will be presented in the paper. |
| Starting Page | 125 |
| Ending Page | 130 |
| File Size | 16666067 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424428137 |
| DOI | 10.1109/ESTC.2008.4684337 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-09-01 |
| Publisher Place | UK |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | ultra-thin film package Stacking Circuits Etching stacked ultra-thin module Substrates Semiconductor device measurement Electric variables measurement Polyimides Packaging embedding Copper Assembly |
| Content Type | Text |
| Resource Type | Article |
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