NDLI: Development of a highly attenuative backing for ultrasonic transducers with periodic arrangement of polymeric rods inside the backing

Content Provider	IEEE Xplore Digital Library
Author	Byungkuk Bae Hyungkeun Lee Susung Lee Wonseok Lee Yongrae Roh
Copyright Year	2013
Description	Author affiliation: Sch. of Mech. Eng., Kyungpook Nat. Univ., Daegu, South Korea (Wonseok Lee; Yongrae Roh) \|\| Probe Dev. Team, Alpinion Med. Syst., Seoul, South Korea (Byungkuk Bae; Hyungkeun Lee; Susung Lee)
Abstract	Backings for ultrasonic transducers are generally made of composites of metal or metal oxide powder and epoxy resin or rubber. In this work, a new highly attenuative backing has been developed by installing cylindrical silicone rubber rods periodically inside the two phase mixture. The scattering of ultrasonic waves is dramatically increased by the polymeric rods, which results in big improvement of the attenuation. The silicone rubber rods are molded first, and are disposed periodically on a plane. Then a mixture of epoxy and metallic powder is casted around the rods, and is cured not to have any vacancies. Another backing plate was fabricated as well with the same mixture but without the silicone rods. The backing plates were characterized through ultrasonic pulse-echo tests. Significant improvement of the attenuation has been confirmed through the experiments. Acoustic impedance of the backing can be increased if needed by controlling the volume percent of tungsten powder without causing much variation of the attenuation. This highly attenuative backing is applicable to various size-constrained ultrasound probes like TEE and mechanical 3D transducers.
Sponsorship	IEEE Ultrason., Ferroelectr., Freq. Control Society
Starting Page	1105
Ending Page	1108
File Size	2404781
Page Count	4
File Format	PDF
ISSN	19485719
e-ISBN	9781467356862
DOI	10.1109/ULTSYM.2013.0283
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-07-21
Publisher Place	Czech Republic
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Attenuation Acoustics Transducers Rubber Materials Powders Impedance passive component backing attenuation
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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