NDLI: Non-contact ultrasonic inspection of CFRP prepregs for aeronautical applications during lay-up fabrication

Content Provider	IEEE Xplore Digital Library
Author	Farinas, M.D. Gomez Alvarez-Arenas, T.E. Cuevas Aguado, E. Garcia Merino, M.
Copyright Year	2013
Description	Author affiliation: TECNATOM, San Sebastián de los Reyes, Spain (Cuevas Aguado, E.; Garcia Merino, M.) \|\| Sensors & Ultrasonic Technol. Dept., ITEFI, Madrid, Spain (Farinas, M.D.; Gomez Alvarez-Arenas, T.E.)
Abstract	The possibility to inspect laminates of prepreg carbon fiber reinforced polymer (CFRP) laminates during lay-up fabrication is studied. First ultrasonic properties of the uncured material are determined, this information is used to design an inspection system that is tested during the fabrication of laminates with up to 30 layers, following different compaction schemes and including some Teflon insertions to simulate the presence of delaminations. The paper shows that for the chosen selection of parameters (transducers sensitivity, centre frequency and mold configuration), the inspection is possible, opening a new field of application of air-coupled ultrasonic techniques.
Sponsorship	IEEE Ultrason., Ferroelectr., Freq. Control Society
Starting Page	1590
Ending Page	1593
File Size	801119
Page Count	4
File Format	PDF
ISSN	19485719
e-ISBN	9781467356862
DOI	10.1109/ULTSYM.2013.0405
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-07-21
Publisher Place	Czech Republic
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Laminates Inspection Compaction Transducers Acoustics Ultrasonic imaging lay-up fabrication Non contact NDT air-coupled transducers uncured CFRP prepregs
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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