NDLI: Fast, automated thermal simulation of three-dimensional integrated circuits

Content Provider	IEEE Xplore Digital Library
Author	Wilkerson, P. Raman, A. Turowski, M.
Copyright Year	2004
Description	Author affiliation: CFD Res. Corp., Huntsville, AL, USA (Wilkerson, P.; Raman, A.; Turowski, M.)
Abstract	Three-dimensional (3D) stacked integrated circuits (ICs) can significantly improve circuit performance and offer the promise of integrating various technologies (memory, logic, RF, mixed-signal, optoelectronics) within a single block. Lack of 3D design tools and heat dissipation from vertically stacked multiple layers are the crucial problems in their development. To address these issues, CFD Research Corporation (CFDRC) is developing methodologies and tools to analyze and assess coupled electrical and thermal performance of 3D ICs, including calculation of realistic full-chip thermal distributions and determining from them signal delay/distortion. Due to the stacking technology, extensive localized heating can occur. Analysis to minimize these hot spots using thermal vias is demonstrated. Our Python-script based framework allows to drive and control all the aspects of the 3D model building (directly from layouts), thermal simulations, and results extraction/post-processing. Hence, it is a good basis for coupling with Electronic Design Automation (EDA) systems. We present results of automated, fast, but detailed thermal simulations of 3D stacked integrated circuits. In addition, procedures for automatic extraction of reduced and compact thermal-resistance-based 3D models have been implemented. These techniques greatly reduce required computational time, and allow for very fast parametric modeling analysis of 3D IC design configurations and temperature extraction. From these thermal resistance models, equivalent SPICE netlists may be generated and used for independent or coupled thermal analysis.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Starting Page	706
Ending Page	713
File Size	1091592
Page Count	8
File Format	PDF
ISBN	0780383575
DOI	10.1109/ITHERM.2004.1319245
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit modeling Three-dimensional integrated circuits Thermal resistance Circuit simulation Electronic design automation and methodology Radiofrequency integrated circuits Circuit optimization Integrated circuit technology Logic circuits Radio frequency
Content Type	Text
Resource Type	Article

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