NDLI: Turbulence modelling and it's impact on CFD predictions for cooling of electronic components

Content Provider	IEEE Xplore Digital Library
Author	Dhinsa, K.K. Bailey, C.J. Pericleous, K.A.
Copyright Year	2004
Description	Author affiliation: Centre for Numerical Modelling & Process Anal., Greenwich Univ., London, UK (Dhinsa, K.K.; Bailey, C.J.; Pericleous, K.A.)
Abstract	This paper will discuss Computational Fluid Dynamics (CFD) results from an investigation into the accuracy of several turbulence models to predict air cooling for electronic packages and systems. Also new transitional turbulence models will be proposed with emphasis on hybrid techniques that use the k-/spl epsiv/ model at an appropriate distance away from the wall and suitable models, with wall functions, near wall regions. A major proportion of heat emitted from electronic packages can be extracted by air cooling. This flow of air throughout an electronic system and the heat extracted is highly dependent on the nature of turbulence present in the flow. The use of CFD for such investigations is fast becoming a powerful and almost essential tool for the design, development and optimization of engineering applications. However turbulence models remain a key issue when tackling such flow phenomena. The reliability of CFD analysis depends heavily on the turbulence model employed together with the wall functions implemented. In order to resolve the abrupt fluctuations experienced by the turbulent energy and other parameters located at near wall regions and shear layers a particularly fine computational mesh is necessary which inevitably increases the computer storage and run-time requirements. The PHYSICA Finite Volume code was used for this investigation. With the exception of the k-/spl epsiv/ and k-/spl omega/ models which are available as standard within PHYSICA, all other turbulence models mentioned were implemented via the source code by the authors. The LVEL, LVEL CAP, Wolfshtein, k-/spl epsiv/, k-/spl omega/, SST and k/spl epsiv//kl models are described and compared with experimental data.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Starting Page	487
Ending Page	494
File Size	765720
Page Count	8
File Format	PDF
ISBN	0780383575
DOI	10.1109/ITHERM.2004.1319214
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Predictive models Computational fluid dynamics Electronics cooling Electronic components Electronics packaging Design optimization Reliability engineering Design engineering Power engineering and energy Power system modeling
Content Type	Text
Resource Type	Article

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