NDLI: Extension of air cooling for high power processors

Content Provider	IEEE Xplore Digital Library
Author	Guoping Xu Guenin, B. Vogel, M.
Copyright Year	2004
Description	Author affiliation: Sun Microsyst. Inc., San Diego, CA, USA (Guoping Xu; Guenin, B.; Vogel, M.)
Abstract	Air cooling limits for a high power CPU with high local power density were explored through a thermal model. The thermal model included a 20 mm/spl times/20 mm die that was assumed to have power dissipation of 160 W and a local power density of 100 W/cm/sup 2/. Package size is assumed to be 50 mm/spl times/50 mm, and the heat sink volume is 100 mm (flow length)/spl times/100 mm (width)/spl times/45 mm (height). The heat sink base is 5 mm thick. The effects of various package materials and configurations; thermal interface material between package and heat sink; heat sink base configurations, parallel plate fin geometries; and air flow conditions on the overall thermal performance have been investigated. Analytical methods are used to predict heat transfer and pressure drop for the parallel plate fin heat sink. Entropy generation rate minimization is applied in the optimization of the fin geometries and flow conditions. Finally, numerical model and heat sink performance results are used to predict air cooling limit.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Starting Page	186
Ending Page	193
File Size	819993
Page Count	8
File Format	PDF
ISBN	0780383575
DOI	10.1109/ITHERM.2004.1319172
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Cooling Heat sinks Thermal resistance Heat transfer Heat pumps Thermal conductivity Electronic packaging thermal management Surface resistance Entropy Power generation
Content Type	Text
Resource Type	Article

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