NDLI: Direct liquid cooling of a stacked MCM

Content Provider	IEEE Xplore Digital Library
Author	Chen, X.Y. Toh, K.C. Wong, T.N. Chai, J.C. Pinjala, D. Navas, O.K. Ganesh Hengyun Zhang Kripesh, V.
Copyright Year	2004
Description	Author affiliation: Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore (Chen, X.Y.; Toh, K.C.; Wong, T.N.; Chai, J.C.)
Abstract	In this paper, the experimental and numerical results for a direct single-phase liquid cooling scheme are presented and discussed for the stacked Multichip Module (MCM). The stacked MCM consists of one substrate, three carriers which are stacked on top of each other and three thermal test chips which are mounted on the carriers by the flip chip attachment method. FC-72 was used as the coolant. Studies were carried out for a single chip being powered in turn and for all three chips powered. The pressure drops between the inlet and outlet were obtained for different flow rates, and the temperature differences in the chips are determined and discussed. A three-dimensional numerical simulation was also conducted to investigate the flow and the conjugate convection-conduction heat transfer in the cooling structure. The maximum limit on the package power currently tested (4 W) is however quite limited because of the high flow bypass and relatively low flow rate. Further analysis indicates that by reducing the bypass, increasing the flow rate and using better coolants, a maximum power of 40 W is achievable for single phase liquid cooling.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Starting Page	199
Ending Page	206
File Size	706162
Page Count	8
File Format	PDF
ISBN	0780383575
DOI	10.1109/ITHERM.2004.1319174
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Liquid cooling Thermal management Coolants Electronic packaging thermal management Electronics packaging Multichip modules Spraying Immersion cooling Testing Temperature
Content Type	Text
Resource Type	Article

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