NDLI: Natural convection enhancement of channel array in conjunction with wall surface

Content Provider	IEEE Xplore Digital Library
Author	Yazawa, K.
Copyright Year	2004
Description	Author affiliation: Sony Corp., Tokyo, Japan (Yazawa, K.)
Abstract	Despite the active air cooling with micro-fan is effective and commonly used, passive cooling enhancement is rather getting important for consumer electronics thermal management. As active air cooling may produce acoustic noise during its operation, the natural convection enhancement can be helpful for the noise reduction by decreasing required active cooling performance. In this report, an approach of dissipating heat through the enclosure wall to the ambient with using channel array built in the wall is proposed and investigated. The inside wall is assumed to contact to isothermal spreader, which spreads the heat from the device. Vertically oriented channels in the composite wall are utilized instead of flat solid wall and are served as mechanical structure as well. The study is focused on typical high dense packaging design of consumer digital electronics as like home-use bookshelf computers. Since the airflow space is limited in the equipment, passive cooling needs to be maximized with spreading the heat generated from the device. Although, passive cooling from skin wall is limited since the maximum allowable temperature must be managed in harmless range for the case user touches the enclosure. The channel structure installed in the wall is found to effectively help the passive cooling with higher channel temperature with maintaining external skin temperature in proper range. Such channel composite wall has a benefit on its flat surface. It does not impact on cosmetic design but fin surface enhancement does impact. The channel gap is limited for space efficient design requirement as well. In such limited range of the composite wall thickness, the effectiveness is demonstrated by analytic model correlated with numerical analysis comparing with single solid isothermal wall. For the typical thermal conditions, the enhancement is found several times effective compare to the single solid wall while the channel composite wall is properly designed.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Starting Page	128
Ending Page	133
File Size	626210
Page Count	6
File Format	PDF
ISBN	0780383575
DOI	10.1109/ITHERM.2004.1319164
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics cooling Temperature distribution Thermal management of electronics Isothermal processes Space heating Skin Solids Consumer electronics Thermal management Acoustic noise
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in