NDLI: CFD simulation of thermal dissipation from fan-added plate fin and offset strip fin heat sinks

Content Provider	IEEE Xplore Digital Library
Author	Won Nyun Kim Seo Young Kim Byung Ha Kang
Copyright Year	2004
Description	Author affiliation: Visual Display Div., Samsung Electr., South Korea (Won Nyun Kim)
Abstract	In the present study, we have performed two-dimensional CFD simulations on thermal dissipation from isothermal plate fins and offset strip fins with a specific DC fan. Computations are implemented on a single flow passage between fins due to the periodicity in the lateral direction, and analysis of thermal performance is carried out for a heat sink for CPU cooling with a width of 60 mm and a length of 65 mm. As anticipated, the offset strip fin leads to 35% higher Nusselt number at each fin surface compared to the plate fin. However, the optimum OSF heat sink has 42% wider fin pitch to compensate for increased pressure drop, which results in smaller fin surface area than the plate fin heat sink. Consequently, the overall thermal performance of the offset strip fin heat sink is about 4% lower than that of the plate fin heat sink considered in this study, irrespective of the enhanced surface geometry.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Starting Page	213
Ending Page	217
File Size	366274
Page Count	5
File Format	PDF
ISBN	0780383575
DOI	10.1109/ITHERM.2004.1319176
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Computational fluid dynamics Strips Heat sinks Heat transfer Performance analysis Cooling Geometry Thermal conductivity Central Processing Unit Research and development
Content Type	Text
Resource Type	Article

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