NDLI: Reliability assessment of copper ball bonds by combination of simulation and accelerated mechanical testing

Content Provider	IEEE Xplore Digital Library
Author	Lederer, M. Lassnig, A. Khatibi, G. Delshadmanesh, M.
Copyright Year	2015
Description	Author affiliation: Fac. of Tech. Chem., Vienna Univ. of Technol., Vienna, Austria (Lederer, M.; Khatibi, G.; Delshadmanesh, M.) \|\| Fac. of Phys., Phys. of Nanostructured Mater., Univ. of Vienna, Vienna, Austria (Lassnig, A.)
Abstract	We have investigated the fatigue strength of copper ball bonds attached to silicon chips covered with an aluminum metallization layer. Under service conditions, the chips are exposed to repeated temperature changes leading to thermo-mechanical stresses. In order to predict their lifetime, accelerated mechanical tests were performed at ultrasonic frequency. Thereby, different setups were tested to optimize the method. The stresses resulting from mechanical tests were compared to deviatoric stresses originating from thermal mismatch of the different materials involved. For this purpose, FEM computer simulations were performed. It was found that the stress distributions of the different setups are quite different. Nevertheless, the weakest link of the construction was always the aluminum metallization layer. In consequence, the number of loading cycles to failure could be related to the von Mises stress observed in the aluminum film.
Sponsorship	IEEE Electron Devices Soc.
Starting Page	1
Ending Page	8
File Size	2700923
Page Count	8
File Format	PDF
e-ISBN	9781479999507
DOI	10.1109/EuroSimE.2015.7103137
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-04-19
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Reliability Strain Lead Copper Estimation
Content Type	Text
Resource Type	Article

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