NDLI: FEA study of damage and cracking risks in BEoL structures under copper wirebonding impact

Content Provider	IEEE Xplore Digital Library
Author	Auersperg, J. Breuer, D. Machani, K.V. Rzepka, S. Michel, B.
Copyright Year	2015
Description	Author affiliation: GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Dresden, Germany (Breuer, D.; Machani, K.V.) \|\| Micro Mater. Center at Fraunhofer ENAS, Chemnitz, Germany (Auersperg, J.; Rzepka, S.; Michel, B.)
Abstract	With the recent increase in Gold (Au) wire cost; Copper (Cu) wire becomes an attractive way to manage overall package cost. On the other hand, Copper wire bonding introduces much higher mechanical impact to underlying BEoLstructures and actives because of the higher stiffness and lower ductility of Copper compared to Gold. These trends are accompanied by the application of new porous or nano-particle filled materials like low-k and ultra low-k materials for Back-end of line (BEoL) layers of advanced CMOS technologies. As a result, higher delamination and cracking risks in BEoLstructures underneath bonded areas represent an increasing challenge for the thermo-mechanical reliability requirements. To overcome the related reliability issues the authors performed a two level nonlinear FEM-simulation approach. Initially nonlinear axisymmetric modeling and simulation of the copper bonding process are coupled with a spatial simulation model of the whole BeoL and bond pad structure. Cracking and delamination risks are estimated by a surface based cohesive contact approach and the utilization of a crushing foam constitutive material model for ultra low-k materials.
Sponsorship	IEEE Electron Devices Soc.
Starting Page	1
Ending Page	5
File Size	1587177
Page Count	5
File Format	PDF
e-ISBN	9781479999507
DOI	10.1109/EuroSimE.2015.7103114
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-04-19
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Load modeling Programmable logic arrays Vibrations Thermomechanical processes Mathematical model
Content Type	Text
Resource Type	Article

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