NDLI: B-Spline X-Ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

Content Provider	IEEE Xplore Digital Library
Author	McNally, P.J.
Copyright Year	2015
Description	Author affiliation: Sch. of Electron. Eng., Dublin City Univ., Dublin, Ireland (McNally, P.J.)
Abstract	Advanced More than Moore integrated circuit chip packaging is leading to the development of multiply stacked silicon die and these die are becoming ever thinner. This is leading to reliability problems. One of these is process induced die strain/warpage and there is no compelling metrology which can non-destructively measure the warpage of the die inside the packaged chips. In this paper we report on a series of techniques, which we call B-Spline X-Ray Diffraction Imaging (B-XRDI). These techniques allow for the rapid reconstruction of strain fields and lattice warpage data from x-ray diffraction images (also known as x-ray topographs) and they can provide for in situ and non-destructive analysis of stresses, strains and deformations inside packaged chip systems for single and multiple die. The technique, which uses synchrotron x-ray sources can be applied, under certain circumstances, to laboratory-based tools.
Sponsorship	IEEE Electron Devices Soc.
Starting Page	1
Ending Page	3
File Size	402216
Page Count	3
File Format	PDF
e-ISBN	9781479999507
DOI	10.1109/EuroSimE.2015.7103166
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-04-19
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	X-ray diffraction Irrigation
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Development of B-spline X-ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

A novel X-ray diffraction technique for analysis of die stress inside fully encapsulated packaged chips

Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages.

Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits

Non-destructive X-Ray mapping of strain & warpage of die in packaged chips

X-ray diffraction imaging of fully packaged n-p-n transistors under accelerated ageing conditions.

X-ray diffraction second derivative spectrum of Tibetan medicine based on the spline interpolation method

Imaging surface acoustic waves on GaAs by X-ray diffraction techniques

A system for x-ray diffraction and fluorescence imaging of nanoparticle biomarkers

B-Spline X-Ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

Similar Documents

Development of B-spline X-ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

A novel X-ray diffraction technique for analysis of die stress inside fully encapsulated packaged chips

Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages.

Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits

Non-destructive X-Ray mapping of strain & warpage of die in packaged chips

X-ray diffraction imaging of fully packaged n-p-n transistors under accelerated ageing conditions.

X-ray diffraction second derivative spectrum of Tibetan medicine based on the spline interpolation method

Imaging surface acoustic waves on GaAs by X-ray diffraction techniques

A system for x-ray diffraction and fluorescence imaging of nanoparticle biomarkers

B-Spline X-Ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips