NDLI: Analyses on a directly attached airbag sensor packaging system

Content Provider	IEEE Xplore Digital Library
Author	Hyun Jin Kang Jong Dae Lee Joon Ki Kim Kim, Y.K.
Copyright Year	2015
Description	Author affiliation: Korea Inst. of Ind. Technol., Incheon, South Korea (Jong Dae Lee; Joon Ki Kim) \|\| Dept. of Convergence Eng. & Manage., Inha Univ., Incheon, South Korea (Hyun Jin Kang; Kim, Y.K.)
Abstract	A side airbag sensor packaging directlly attached to the side frame (center pillar) of automobiles by adhesive is introduced in this study. To assess the feasibility for the packaging, a test instrument was manufactured to examine the impact sensibility by drop tests. The conventional sensor module with plastic housiung and the new sensor packaging were installed to aluminum channel, and the results were compared with each other. Numerical analyses were also performed to investigate the signal characteristics created by the sensors. The prerliminary results showed that the signals from the directly attached sensors represented more distinctive with less noise, presummably due to the absence of the vibration caused by the housing structure of the conventional sensor.
Sponsorship	IEEE Electron Devices Soc.
Starting Page	1
Ending Page	3
File Size	727222
Page Count	3
File Format	PDF
e-ISBN	9781479999507
DOI	10.1109/EuroSimE.2015.7103158
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-04-19
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromechanical devices Mechanical variables measurement Atmospheric modeling Analytical models Numerical models Accidents
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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