NDLI: Study on thermomechanical reliability of power modules and thermal grease pump-out mechanism

Content Provider	IEEE Xplore Digital Library
Author	Jue Li Myllykoski, P. Paulasto-Krockel, M.
Copyright Year	2015
Description	Author affiliation: Dept. of Electr. Eng. & Autom., Aalto Univ., Aalto, Finland (Jue Li; Paulasto-Krockel, M.) \|\| ABB Drives, Helsinki, Finland (Myllykoski, P.)
Abstract	This paper focuses on two major thermomechanical reliability topics related to high power devices such as insulated gate bipolar transistor (IGBT) modules. Firstly, the stress-free status and the thermal residual stress of a typical power module are investigated by finite element method (FEM) analysis. After determining the thermal residual stresses at room temperature, thermal cycling (TC) and power cycling (PC) tests are conducted and simulated by FEM. Secondly, the thermal grease pump-out phenomenon is explicitly simulated via a combined FEM and smoothed particle hydrodynamic (SPH) method for the first time. SPH method shows great potential for the thermal grease material selection and engineering, base plate optimization, and thermomechanical reliability optimization of power devices in general. The simulated contact opening results at the interface between copper base plate and heat sink indicates different pumping modes associated with different loading conditions. All modeling approaches presented in this work offer insight into our understanding of deformation, stress status, and thermal grease related failure mechanisms of high power devices.
Sponsorship	IEEE Electron Devices Soc.
Starting Page	1
Ending Page	6
File Size	1490933
Page Count	6
File Format	PDF
e-ISBN	9781479999507
DOI	10.1109/EuroSimE.2015.7103076
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-04-19
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Analytical models Iron Reliability Finite element analysis Trigeneration Copper
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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