NDLI: In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor

Content Provider	IEEE Xplore Digital Library
Author	Palczynska, A. Gromala, P.J. Mayer, D. Bongtae Han Melz, T.
Copyright Year	2015
Description	Author affiliation: Reliability Modeling & Syst. Optimization (AE/EDT3), Robert Bosch GmbH, Reutlingen, Germany (Palczynska, A.; Gromala, P.J.) \|\| Mech. Eng. Dept., Univ. of Maryland, College Park, MD, USA (Bongtae Han) \|\| Fraunhofer-Inst. fur Betriebsfestigkeit und Systemzuverlassigkeit LBF, Darmstadt, Germany (Mayer, D.; Melz, T.)
Abstract	The relaxation behavior of an epoxy molding compound (EMC) subjected to a constant strain can cause new reliability challenges in automotive electronics. This problem will be exacerbated due to the ever-increasing demand in modern electronics systems for miniaturization with more functionality, yet it has not been studied extensively to mitigate its effect on reliability. In this study, a piezoresistive silicon-based stress sensor is used to understand the stress state in an ECU, more specifically the relaxation behavior of EMC caused by the storage time of an ECU (i.e., duration between production and actual usage). Mechanical stresses are measured by the piezoresistive stress sensor that is encapsulated in a standard microelectronic 3 × 3 mm land grid array (LGA) package. The relaxation behavior is observed at three different temperatures for one week: 75 °C, 100 °C and 125 °C. The relaxation behavior is measured continuously for one more week after cooling the package to room temperature (at 25 °C). An additional test is conducted at 85°C with 85% relative humidity to investigate the effect of moisture diffusion on the package. The experimental results clearly indicate that the proposed approach can be used for better understanding of the evolution of stresses in molded packages during their lifetime, especially during storage, which in turn can lead to more optimal designs in the future.
Sponsorship	IEEE Electron Devices Soc.
Starting Page	1
Ending Page	5
File Size	1953045
Page Count	5
File Format	PDF
e-ISBN	9781479999507
DOI	10.1109/EuroSimE.2015.7103099
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-04-19
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Reliability Strain Standards Temperature sensors Radio frequency Plastics Moisture
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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