NDLI: Thermo-mechanical simulations of SiC power modules with single and double sided cooling

Content Provider	IEEE Xplore Digital Library
Author	Brinkfeldt, K. Edwards, M. Ottosson, J. Neumaier, K. Zschieschang, O. Otto, A. Kaulfersch, E. Andersson, D.
Copyright Year	2015
Description	Author affiliation: Berliner Nanotest und Design GmbH, Berlin, Germany (Kaulfersch, E.) \|\| Volvo Group Truck Technol., Goteborg, Sweden (Ottosson, J.) \|\| Chalmers Univ. of Technol., Goteborg, Sweden (Edwards, M.) \|\| Swerea IVF, Mölndal, Sweden (Brinkfeldt, K.; Andersson, D.) \|\| Fraunhofer ENAS, Chemnitz, Germany (Otto, A.) \|\| Fairchild Semicond. GmbH, Aschheim, Germany (Neumaier, K.; Zschieschang, O.)
Abstract	Effectively removing dissipated heat from the switching devices enables a higher current carrying capability per chip area ratio, thus leading to smaller or fewer devices for a given power requirement specification. Further, the use of SiC based devices has proven to increase the efficiency of the system thereby reducing the dissipated heat. Thermal models have been used to compare SiC power modules. Single and double sided cooling have been simulated. The simulated maximum temperatures were 141 °C for the single sided version and 119.7 °C for the double sided version. In addition, the reliability of a single sided module and thermally induced plastic strains of a double sided module have been investigated. A local model of the wire bond interface to the transistor metallization shows a $3^{0}/_{00}$ maximum increase in plastic strain during the power cycle. Simulations of the creep strain rates in the die attach solder layer for a power cycling loads also shows a $3^{0}/_{00}$ increase in creep strain per cycle.
Sponsorship	IEEE Electron Devices Soc.
Starting Page	1
Ending Page	7
File Size	1362715
Page Count	7
File Format	PDF
e-ISBN	9781479999507
DOI	10.1109/EuroSimE.2015.7103136
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-04-19
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Plastics Switches Reliability
Content Type	Text
Resource Type	Article

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