NDLI: Cost-optimal design of wireless pre-bonding test framework

Content Provider	IEEE Xplore Digital Library
Author	Chandran, U. Dan Zhao
Copyright Year	2014
Description	Author affiliation: Center for Adv. Comput. Studies, Univ. of Louisiana at Lafayette, Lafayette, LA, USA (Chandran, U.; Dan Zhao)
Abstract	In a three-dimensional stacked IC (3D-SIC), pre-bonding die tests are performed to test different functional components on dies as the yield of 3D-SIC highly depends on the quality of dies used for stacking. In observing the test challenges in pre-bonding, contactless wireless probing using inductive coupling has been introduced to provide high bandwidth test data transfer without the stress-induced damage. Aiming at high bandwidth high parallel pre-bonding test, a hybrid wireless test framework is established in this paper by utilizing such wireless probing techniques. Under the hybrid test framework, both IP cores and embedded TSVs are tested concurrently by applying scan methodology and BIST respectively. To exploit the performance-cost effectiveness of our new architecture, a test scheduling scheme is thereby proposed to optimize the test resource distribution and minimize test application time. The simulation study demonstrates the wireless test capability and the feasibility of a hybrid wireless test infrastructure.
Sponsorship	IEEE Circuits Syst. Soc.
Starting Page	324
Ending Page	329
File Size	839552
Page Count	6
File Format	PDF
ISBN	9781479933785
ISSN	21641706
DOI	10.1109/SOCC.2014.6948948
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-09-02
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wireless communication IP networks Resource management Propulsion Copper Transportation
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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