NDLI: Ultra fine pitch 20 micron 2N second bond Improvement with new capillary surface morphology

Content Provider	IEEE Xplore Digital Library
Author	Nor, N.H.M. Taib, S. Ahmad, I. Abdullah, H.
Copyright Year	2008
Description	Author affiliation: Fac. of Eng., Dept. of Electr., Electron. & Syst., Nat. Univ. of Malaysia (UKM), Bangi (Nor, N.H.M.; Abdullah, H.) \|\| Dept. of Electron. & Commun., Univ. Tenaga Nasional, Kajang (Ahmad, I.) \|\| Infineon Technol. (M) Sdn Bhd, Malacca (Taib, S.)
Abstract	Wire bonding of 20 micron 2N wire using conventional pink capillary for ultra Fine Pitch package results in high stoppages of short tail which causes machine to stop, higher yield loss and reduced equipment efficiency and stability. The objective of present study is to improve the $2^{nd}$ bond quality and stability for reducing the stoppages caused by the short tail. The new design, called as Fortus capillaries have granular tip surface morphology that improves mechanical interlocking, relative displacement between capillarypsilas tip and wire, and also improve the energy transfer efficiency at wire-lead inter layer surface. Statistical analysis comparisons and internal physical inspection were done through SEM image at 0 hour, 96 hours and 192 hours after High Temperature Storage (HTS) and 500x and 1000x Thermal cycle. Cross section analysis was also done to study the Inter Metallic Compound (IMC) formation between wire and lead plating. The Fortus pink capillary effectiveness in reducing short tail was proven in actual production during 5000 unit wire bond process operation with 75% improvement of machine stoppages and resulting in significant improvement of production yield up to 99.5%. This new granular tip capillary also gave about 100% improvement compared to the conventional capillaries life.
Starting Page	406
Ending Page	409
File Size	3498692
Page Count	4
File Format	PDF
ISBN	9781424438730
DOI	10.1109/SMELEC.2008.4770351
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-11-25
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Surface morphology Wire Tail Stability Image storage Production Packaging machines Energy exchange Statistical analysis
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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