NDLI: A coupled-field fluid-structure interaction (FSI) simulation of an electrostatically actuated diaphragm valveless micropump (EDVM)

Content Provider	IEEE Xplore Digital Library
Author	Hing Wah Lee Syono, M.I. Azid, I.
Copyright Year	2008
Description	Author affiliation: Microfludics & BioMEMS, Technol. Park, Kuala Lumpur (Hing Wah Lee; Syono, M.I.) \|\| Dept. of Mech. Eng., Univ. Sains Malaysia, Perai (Azid, I.)
Abstract	In this study, a novel approach in designing an electrostatically actuated diaphragm valveless micropump (EDVM) based on CMOS-compatible surface micromachining (SMM) fabrication process has been presented. One major advantage of the designed EDVM using SMM process as compared to conventional EDVM fabricated using bulk micromachining process is that the actuation voltage is now applied across the working fluid. The working fluid must be included in the simulations as it will now have a major influence on the response and characteristics of the micropump. In view of that, a coupled-field electro-mechanical-fluidic model of the EDVM has been simulated using MemFSItrade, a fluid-structure interaction (FSI) solver available in CoventorWaretrade software package. Results obtained from the CoventorWaretrade simulations are compared with analytical studies for verification purposes. The designed EDVM with a diaphragm size of 1mm times 1mm times 0.5 mum is able to generate flow rates of up to 10nl/min for a low actuation voltage of 3V.
Starting Page	143
Ending Page	147
File Size	2023872
Page Count	5
File Format	PDF
ISBN	9781424438730
DOI	10.1109/SMELEC.2008.4770295
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-11-25
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micropumps Voltage Electrodes Fabrication Pumps Micromechanical devices Sensor systems Temperature sensors Valves Electrostatics
Content Type	Text
Resource Type	Article

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