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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chan Sieng Fong Ng Hong Seng |
| Copyright Year | 2008 |
| Description | Author affiliation: X-FAB Sarawak Sdn. Bhd., Kuching (Chan Sieng Fong; Ng Hong Seng) |
| Abstract | Chemical staining is commonly used to delineate sample for construction analysis. A wide range of wet etchants are available such as acid-based, alkaline-based solutions and organic solvents. Etch artifacts and over-etched profile maybe observed after wet staining on metal profile. Wet chemical treatment is also essential after dry etching during RIE delayering to reveal metallization of interest. The plasma residue on metal surface should be eliminated to enable accurate metal profile inspection. In this paper, the impact of different wet chemical solutions on SEM image quality is presented. Construction analysis and delayering were focused on metallization. |
| Starting Page | 410 |
| Ending Page | 413 |
| File Size | 1324158 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424438730 |
| DOI | 10.1109/SMELEC.2008.4770352 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-11-25 |
| Publisher Place | Malaysia |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Metallization Image quality Chemical analysis Wet etching Delay Solvents Dry etching Plasma applications Plasma chemistry Surface treatment |
| Content Type | Text |
| Resource Type | Article |
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