NDLI: Inductively Coupled Discharge Plasma Accelerator

Content Provider	IEEE Xplore Digital Library
Author	Wontaek Park Volynets, V.N. Tolmachev, Yu.N. Pashkovsky, V.G. Jinwoo Yoo
Copyright Year	2005
Description	Author affiliation: Nano Fabrication Center, Samsung Adv. Inst. of Technol., Suwon (Wontaek Park; Volynets, V.N.; Tolmachev, Yu.N.; Pashkovsky, V.G.; Jinwoo Yoo)
Abstract	Summary form only given. Electromagnetic acceleration for generating an electrically neutral, high flux plasma beam and a system for carrying out this method are studied for the semiconductor etching process having no charging damage and space missions. In the capacitively coupled discharge plasma accelerator, a certain amount of electrode sputtering is inevitable from the ion bombardment flux. This causes serious problems in semiconductor etching process and usual plasma thrusters. Our system consists of the inductively coupled discharge plasma accelerator, stainless steel vacuum chamber with turbomolecular pumping, and power supply system. The accelerator consists of two coaxial cylinders made of dielectric material such as quartz. The induction coils are installed at the surface of external and internal cylinders for the designed magnetic field configuration directed radially and having axial gradient. Plasma in an inductive discharge is created by application of 2 MHz RF power to a non-resonant inductive coil. Interaction of discharge current with the magnetic field provides a (JtimesB) body force to accelerate the plasma away from the accelerator. Our experimental results show the another way of plasma thrusters, and the plasma accelerator can be utilized in semiconductor process. The plasma flux to the wafer is electrically neutral, the plasma density is more than $10^{11}/cm^{-3},$ and the ion kinetic energy is expected to be 50 eV for the consumed power about 2000 W
Sponsorship	Plasma Sci. Appl. Comm. IEEE Nucl. Plasma Sci. Soc.
Starting Page	224
Ending Page	224
File Size	843681
Page Count	1
File Format	PDF
ISBN	0780393007
ISSN	07309244
DOI	10.1109/PLASMA.2005.359277
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-06-20
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Plasma accelerators Plasma applications Plasma density Acceleration Sputter etching Plasma materials processing Coils Magnetic fields Particle beams Space missions
Content Type	Text
Resource Type	Article
Subject	Atomic and Molecular Physics, and Optics Condensed Matter Physics Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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