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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yoon-Taek Jang Tae-Hoon Huh Jae-Sang Ro |
| Copyright Year | 1999 |
| Description | Author affiliation: Dept. of Metall., Hong-Ik Univ., Seoul, South Korea (Yoon-Taek Jang) |
| Abstract | MeV ion implantation has been recently employed in the field of CMOS (complementary metal oxide semiconductor) retrograde well engineering. An issue on MeV ion induced damage is critical especially in forming a buried layer below the well. MeV B implanted buried layers were observed to show greatly improved characteristics of latchup suppression. Junction leakage current, however, showed a critical behavior as a function of ion dose. The rod-like defects were observed to be responsible for the leakage current. Rod-like defects were generated near the R/sub p/ (projected range) region and grown upward to the surface during annealing. According to cross sectional examination of etch pit density, they were generated and propagated between 700/spl deg/C and 800/spl deg/C. They shrink or change into long, elongated dislocation loops at higher temperatures above 900/spl deg/C. Results of SIMS (secondary ion mass spectroscopy) analyses and two-step-annealing (700/spl deg/C/3/spl sim/6 hrs./spl rarr/900/spl deg/C/1 hr.) indicate that interstitial oxygens impede shrinkage of existing rod-like defects at higher temperatures above 900/spl deg/C. |
| Starting Page | 959 |
| Ending Page | 962 |
| File Size | 629290 |
| Page Count | 4 |
| File Format | |
| ISBN | 078034538X |
| DOI | 10.1109/IIT.1998.813837 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1998-06-22 |
| Publisher Place | Japan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Fabrication Leakage current Ion implantation Etching Annealing Temperature Doping Impurities Electric variables Optical microscopy |
| Content Type | Text |
| Resource Type | Article |
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