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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Nabavi, M.R. Nihtianov, S. |
| Copyright Year | 2008 |
| Description | Author affiliation: Electron. Instrum. Lab., Delft Univ. of Technol., Delft (Nabavi, M.R.; Nihtianov, S.) |
| Abstract | In this paper we present a low-power interface for eddy current displacement sensors with digital output. A measurement method and a new front-end circuit are proposed. The front-end circuit demonstrates an excellent thermal stability, high-resolution and low power consumption. The demodulation principle, as well as the interface implementation, is addressed. This interface is introduced for measuring sub-micron displacements in medium to high-resolution applications. The system will consume less than 12 mW, and will have an extremely low thermal drift. The interface circuits will be implemented as a system in a package (SIP). The full-scale range of displacement is 1 mm with 50 KHz signal bandwidth and 11 bits resolution (less than 500 nm). The signal conditioning circuit utilizes a standard 0.35 mum CMOS technology. The discussions are based on simulations and preliminary experimental results, promising a proper operation of the sensor. |
| Starting Page | 17 |
| Ending Page | 20 |
| File Size | 2554608 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424415403 |
| ISSN | 10915281 |
| DOI | 10.1109/IMTC.2008.4546996 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-05-12 |
| Publisher Place | Canada |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Eddy currents CMOS technology Circuit stability Thermal stability Energy consumption Demodulation Displacement measurement Packaging Bandwidth Signal resolution medium/high resolution Displacement sensors low-power interface |
| Content Type | Text |
| Resource Type | Article |
| Subject | Instrumentation Electrical and Electronic Engineering |
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