NDLI: Research on preparation and properties of rapid adhesive for bonding raised pavement markers

Content Provider	IEEE Xplore Digital Library
Author	Hengquan Liu Lei Peng Zhiyong Zhang Donghua Guo Zuojun Bao Wenyuan Han
Copyright Year	2011
Description	Author affiliation: Key Laboratory of Road Safety Ministry of Transport PRC, Research Institute of Highway Ministry of Transport, Beijing, China (Hengquan Liu; Lei Peng; Zhiyong Zhang; Donghua Guo; Zuojun Bao; Wenyuan Han)
Abstract	The purpose of this study is to develop an environment-friendly solvent-free rapid adhesive for bonding raised pavement markers. This adhesive is composed of two components, the main agent without solvent and curing agent. Firstly, the film forming substance of the main agent is prepared by polyurethane/epoxy resin IPN composite. Secondly, the main agent is composed of the film forming substance, pigment, filler and additives. Through compression-shear strength test, pull-off test and compression test, and so on, comprehensive properties of the adhesive are systematically researched. The results show that compression-shear strength, adhesive bond strength, compression strength, anti-cracking performance at low temperature and weathering resistance of this adhesive are excellent under the optimum formula, and that the adhesive also has the characteristics of rapid construction (60 minutes after construction open to traffic) in low temperature (−10°), which makes this adhesive especially suitable for rapidly bonding raised pavement markers of road in cold regions.
Starting Page	6766
Ending Page	6769
File Size	328739
Page Count	4
File Format	PDF
ISBN	9781424494361
e-ISBN	9781424494392
DOI	10.1109/MACE.2011.5988600
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-07-15
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Adhesives Roads Films Raised pavement markers Environment-friendly solvent-free Low temperature fast curing Curing Interpenetrating polymer networks Rapid adhesive
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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