NDLI: A novel entropy production based full-chip TSV fatigue analysis

Content Provider	IEEE Xplore Digital Library
Author	Tianchen Wang Samal, S.K. Sung Kyu Lim Yiyu Shi
Copyright Year	2015
Description	Author affiliation: Sch. of ECE, Georgia Inst. of Technol., Atlanta, GA, USA (Samal, S.K.; Sung Kyu Lim) \|\| Univ. of Notre Dame, Notre Dame, IN, USA (Tianchen Wang; Yiyu Shi)
Abstract	Through-silicon vias (TSVs) are subject to thermal fatigue due to stress over time, no matter how small the stress is. Existing works on TSV fatigue all rely on measurement-based parameters to estimate the lifetime, and cannot consider detailed thermal profiles. In this paper, we propose a new method for TSV fatigue prediction using entropy production during thermal cycles, which is validated by theoretical analysis and measurement results. By combining thermodynamics and mechanics laws, the fatigue process can be quantitatively evaluated with detailed thermal profiles. Experimental results show that interestingly, the landing pad possesses the most easy-to-fail region, which generates up to 50% more entropy compared with the TSV body. The impact of landing pad dimension and TSV geometries are also studied, providing guidance for reliability enhancement. Finally, full-chip fatigue analysis is performed based on stress superposition. To the best of the authors' knowledge, this is the first TSV fatigue model that is free of measurement data fitting, the first that is capable of considering detailed thermal profiles, and the first framework for efficient full-chip TSV fatigue analysis.
Starting Page	744
Ending Page	751
File Size	5533328
Page Count	8
File Format	PDF
e-ISBN	9781467383882
DOI	10.1109/ICCAD.2015.7372644
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-11-02
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Entropy Stress Production Strain Plastics Through-silicon vias
Content Type	Text
Resource Type	Article

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