NDLI: Cohesive-Zone Explicit Submodeling for Shock Life-Prediction in Electronics

Content Provider	IEEE Xplore Digital Library
Author	Lall, P. Gupte, S. Choudhary, P. Darveaux, R.
Copyright Year	1999
Abstract	Modeling transient-dynamics of electronic assemblies is a multiscale problem requiring methodologies which allow the capture of layer dimensions of solder interconnects, pads, and chip-level interconnects simultaneously with assembly architecture and rigid-body motion. Computational effort needed to attain fine mesh to model chip interconnects while capturing the system-level dynamic behavior is challenging. Product-level testing depends heavily on experimental methods and is influenced by various factors such as the drop height, orientation of drop, and variations in product design. Modeling and simulation of integrated circuit (IC) packages are very efficient tools for design analysis and optimization. Previously, various modeling approaches have been pursued to predict the transient dynamics of electronics assemblies assuming symmetry of the electronic assemblies. In this paper, modeling approaches to predict the solder joint reliability in electronic assemblies subjected to high mechanical shocks have been developed. Two modeling approaches are proposed in this paper to enable life prediction under both symmetric and anti-symmetric transient-deformation. In the first approach, drop simulations of printed circuit board assemblies in various orientations have been carried out using beam-shell modeling methodologies without any assumptions of symmetry. This approach enables the prediction of full-field stress-strain distribution in the system over the entire drop event. Transient dynamic behavior of the board assemblies in free and JEDEC drop has been measured using high-speed strain and displacement measurements. Relative displacement and strain histories predicted by modeling have been correlated with experimental data. Failure data obtained by solder joint array tensile tests on ball grid array packages is used as a failure proxy to predict the failure in solder interconnections modeled using Timoshenko beam elements in the global model. In the second approach, cohesive elements have been incorporated in the local model at the solder joint-copper pad interface at both the printed circuit board (PCB) and package side. The constitutive response of the cohesive elements was based on a traction-separation behavior derived from fracture mechanics. Damage initiation and evolution criteria are specified to ensure progressive degradation of the material stiffness leading to cohesive element failure. Use of cohesive zone modeling (CZM) enabled the detection of dynamic crack initiation and propagation leading to intermetallic compound (IMC) brittle failure in PCB assemblies subject to drop impact. Data on solder interconnect failure has been obtained under free-drop and JEDEC-drop test.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	365
Ending Page	377
Page Count	13
File Size	2682869
File Format	PDF
ISSN	15213331
Volume Number	32
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-06-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electric shock Assembly Predictive models Integrated circuit interconnections Integrated circuit modeling Soldering Electronics packaging Printed circuits Displacement measurement Strain measurement reliability testing Failure analysis finite-element methods reliability modeling
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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