NDLI: Process management system analysis and design of SMT reflow soldering process

Content Provider	IEEE Xplore Digital Library
Author	Li Chun-quan Wu Zhao-hua
Copyright Year	2005
Description	Author affiliation: Dept. of Electron. Machinery & Transp. Eng., Guilin Univ. of Electron. Technol., China (Li Chun-quan; Wu Zhao-hua)
Abstract	Reflow soldering processes are the key processes affecting SMT product quality. First, in the paper, the essential of building SMT processes management was discussed. Then, based on the discussion, taking temperature data as the primary object, process management system analysis of reflow soldering processes was achieved from three aspects: temperature data acquisition, long-distance temperature data transmission and process management software design of reflow soldering processes. At last, general structure of system was advanced and process management system of SMT reflow soldering processes was built through hardware and software designs. The system can promote the improvement of process management ability and level of reflow soldering processes.
Starting Page	279
Ending Page	284
File Size	743134
Page Count	6
File Format	PDF
ISBN	0780394496
DOI	10.1109/ICEPT.2005.1564743
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-08-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	System analysis and design Surface-mount technology Reflow soldering Temperature Data acquisition Real time systems Data analysis Buildings Data communication Software design system design SMT reflow soldering processes process management
Content Type	Text
Resource Type	Article

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