NDLI: Structural Similarity as a Method to Reduce Qualification Tests

Content Provider	IEEE Xplore Digital Library
Author	van Driel, W.D. Zhang, G.Q. Ernst, L.G.
Copyright Year	2005
Description	Author affiliation: Philips Semicond., Nijmegen (van Driel, W.D.; Zhang, G.Q.)
Abstract	To efficiently select qualification and reliability monitoring programs, structural similarity rules for integrated circuit designs, wafer fabrication processes and/or package designs are currently used by the industry. By following the package structural similarity rules, the numbers of reliability qualification tests may be greatly reduced. However, when looking at the present rules it is clear that they are not reliably defined. For instance, geometrical parameters such as die-to-pad ratio are not quantitatively included and it seems that linear relationships are assumed. Besides that, these rules are mainly deducted from experience and industrial trial and error results, not from reliability physics. Driven by the present development trends of microelectronics (miniaturization, integration, cost reduction, etc) it is urgently needed to develop 'structural similarity rules' based on reliability physics (physics of failures), to meet the industrial development trends. In this study, we have used simulation-based optimization techniques to deduct such structural similarity rules. Parametric 3D non-linear FE models are used to explore the responses of the complete BGA family for both the thermo-mechanical and moisture-diffusion responses as function of six parameters among which the die-to-pad ratio and the body size. In this way, structural similarity rules are deduced which can be used to shorten design cycles. Even more, by using the accurate 3D nonlinear reliability prediction models, an Excel-based tool is created for package designers. By using this tool, the number of reliability qualification tests can be reduced. More importantly, possible failure mechanisms can be (better) understood and predicted
Starting Page	1
Ending Page	6
File Size	528527
Page Count	6
File Format	PDF
ISBN	0780394496
DOI	10.1109/ICEPT.2005.1564622
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-08-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Qualifications Integrated circuit reliability Physics Circuit testing Integrated circuit packaging Monitoring Integrated circuit synthesis Fabrication Textile industry Industrial relations
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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