NDLI: Effects of Testing Conditions and Multiple Reflows on Cold Bump Pull Test of Pb-free Solder Balls

Content Provider	IEEE Xplore Digital Library
Author	Fubin Song Lee, S.W.R.
Copyright Year	2005
Description	Author affiliation: Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol. (Fubin Song; Lee, S.W.R.)
Abstract	Ball pull test has emerged to be an attractive alternative to the traditional ball shear testing method for characterizing the attachment strength of solder interconnection. Since this is a relatively new development, so far there is no industrial standard to regulate this testing method. In this study, the pull and shear tests are performed on plastic ball grid array (PBGA) solder balls with Sn-4.0Ag-0.5Cu and Sn-37Pb solders, subject to a wide variety of testing conditions. To investigate the material sensitivity of Sn-Ag-Cu and Sn-Pb solder balls, different pull speeds are used on both kinds of solder balls for comparison. The pull speed ranges from 25 mum/s to 5000 mum/s, while the shear speed ranges from 25 mum/s to 500 mum/s. The pull and shear tests are also conducted on samples with Sn-Ag-Cu and Sn-Pb solder balls after multiple reflows. Various failure modes of ball shear and ball pull tests are discussed for comparison. The sensitivity of both methods on brittle interface fracture is addressed. Furthermore, different pull speeds are applied to Pb-free solder samples after multi-reflows. Favorable testing conditions will be recommended
Starting Page	1
Ending Page	7
File Size	1492441
Page Count	7
File Format	PDF
ISBN	0780394496
DOI	10.1109/ICEPT.2005.1564698
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-08-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lead Environmentally friendly manufacturing techniques Soldering Electronic equipment testing Conducting materials Bonding Electronics packaging Temperature Tensile stress Mechanical engineering
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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