NDLI: Micromachined Packaging for Ultrasonic Transducers with Particle Restraint Mechanisms

Content Provider	IEEE Xplore Digital Library
Author	Hsing-Cheng Chang Chi-Chih Lai Hsien-Hui Tseng Yen-Ju Chen
Copyright Year	2005
Description	Author affiliation: Dept. of Autom. Control Eng., Feng Chia Univ., Taichung (Hsing-Cheng Chang; Chi-Chih Lai)
Abstract	The ultrasonic transducer's micropackaging with particle pollution restraint mechanisms using micromachining process is proposed. The developed packaging with active dustproof mechanisms is very promising, because it permits the advantages of shielding, protection, reliability and signal connection. Technical approaches to the capacitive micro-ultrasonic transducer packaging are divided into three parts: micromachining cap structures, die attachments, and dustproof mechanisms. Simulations for handling the packaging issues are relatively developed. Features of the technology for restraint electrodes on microcap are described. The measurements for various physical and electrical parameters and the packaging needed to make optimal measurements is given. Future directions and potentials of the packaging technology are discussed
Starting Page	1
Ending Page	7
File Size	778970
Page Count	7
File Format	PDF
ISBN	0780394496
DOI	10.1109/ICEPT.2005.1564684
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-08-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Ultrasonic transducers Electronics packaging Protection Electronic packaging thermal management Thermal stresses Pollution measurement Ultrasonic variables measurement Costs Acoustic propagation Micromachining
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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