NDLI: Reflow profile simulation by finite element method for a BGA package

Content Provider	IEEE Xplore Digital Library
Author	Shen Liang Wang Mingxiang He YongHong Lam Tim Fai Jiang Yu Qi
Copyright Year	2005
Description	Author affiliation: Dept. of Microelectron., Soochow Univ., Suzhou, China (Shen Liang; Wang Mingxiang)
Abstract	During reflow process, solder ball temperature profile is a concern, but it is difficult to direct measure the temperature. In this study, a forced convective airflow reflow furnace was analyzed. Measured profiles from two typical BGA packages were simulated successfully. Temperature profile of package surface has been compared with that of solder balls. Temperature distribution among solder ball array has been observed and analyzed. It has been found that impinging jet airflow model provides appropriate convective heat transfer coefficient that can be applied to profile simulation successfully. Dominant heat transfer mechanism is vertical thermal conduction from package top surface to solder ball, while other heat transfer mechanism also have notable effects on solder ball temperature. Solder ball array layout has a significant effect on temperature uniformity of solder balls. A uniform distribution can be obtained when all the balls are located under chip area.
Starting Page	419
Ending Page	422
File Size	354318
Page Count	4
File Format	PDF
ISBN	0780394496
DOI	10.1109/ICEPT.2005.1564717
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-08-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Finite element methods Packaging Furnaces Semiconductor device modeling Heat transfer Heating Temperature distribution Belts Temperature measurement Boundary conditions
Content Type	Text
Resource Type	Article

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