NDLI: Effect of Bi on the microstructure evolution of Sn-3Ag-0.5Cu/Cu solder joint

Content Provider	IEEE Xplore Digital Library
Author	Qi Lin Zhao Jie Wang Lai Han Shuangqi
Copyright Year	2003
Description	Author affiliation: Dept. of Mater. Eng., Dalian Univ. of Technol., China (Qi Lin; Zhao Jie; Wang Lai; Han Shuangqi)
Abstract	The reliability of the solder joints is very important for lead-free solders to be applied extensively. The properties of joints have a close relationship with microstructure of the joints (W. Yang et al., J. Electr. Mater. vol. 24, no. 10, 1995). Therefore, this paper studied the microstructure evolution of Sn-3Ag-0.5Cu-XBi/Cu (where X=0-3%) solder joints after aging at varying temperatures. Sn-Ag-Cu-Bi solders have been selected for research because experiments revealed the eutectic Sn-Ag-Cu alloy to be a very promising solder in avionics and automotive applications where the solder joints are subject to numerous thermal cycles and mechanical vibrations. It has good wetting properties and forms good quality joints with copper, and also has good thermo-mechanical properties and soldering technology (C.M. Miller et al, ibid., vol. 23, no. 7, 1994), but compared with SnPb eutectic, it has higher melting temperature and high cost. It is well known that Bi has beneficial effect on mechanical properties of bulk solder when the addition of Bi is within 3%; however, there are only initial reports on the effect of Bi in solder joints, and a full understanding of Bi effects in solder applications is crucial.
Sponsorship	Chinese Inst. of Electron
Starting Page	265
Ending Page	269
File Size	405940
Page Count	5
File Format	PDF
ISBN	0780381688
DOI	10.1109/EPTC.2003.1298737
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-10-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bismuth Microstructure Soldering Copper Temperature Environmentally friendly manufacturing techniques Lead Aging Aerospace electronics Automotive applications
Content Type	Text
Resource Type	Article

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